In the meeting room of the Advanced Lithography Laboratory at String Light Research Institute, the air hung heavy, almost dripping with tension. Around the oval long table sat top domestic experts in lithography and core members of Xiuxiu's team—including several white‑haired, respected senior academicians. On the projection screen, two technical routes' architecture diagrams and data comparisons stood side‑by‑side, like two forks pointing toward a fog‑shrouded future. The meeting's subject concerned the life‑and‑death artery of China's extreme‑ultraviolet (EUV) lithography technology—**the final choice of light‑source technical route**.
Xiuxiu sat at the head seat, posture erect, but hands under the table subconsciously clenched slightly. Her open notebook lay densely filled with points from both sides' arguments, alongside her own repeatedly‑calculated data and sketches. The EUV lithography machine—the gem at the pinnacle of semiconductor industry's pyramid—faced core challenges, one being generating extreme‑ultraviolet light at just **13.5‑nanometer** wavelength. How to produce sufficiently powerful, stable light source became a chasm the team must cross. Now, serious divergence emerged within the team on this fundamental issue.
The debate focused on two mainstream technical paths: **Laser‑Produced Plasma (LPP)** and **Discharge‑Produced Plasma (DPP)**.
A senior expert supporting exploration of DPP route, Professor Chen, adjusted his glasses, restating his view—tone steady and forceful. "Chief Xiuxiu, colleagues, I believe we must seriously reconsider DPP route's potential. Yes, I admit, currently world‑leading ASML adopts LPP route and succeeded. But we cannot ignore DPP's inherent advantage—**relatively simpler structure**."
He pointed to DPP's architecture diagram—a device containing electrodes, gas‑injection system, pulse‑power module. "It doesn't need LPP's extremely complex, expensive ultra‑high‑power, high‑repetition‑rate CO₂ drive laser, nor exquisitely precise tin‑droplet target generator. Its core: powerful current pulse discharging between electrodes directly ionizes working medium (e.g., xenon or tin vapor) producing plasma, radiating EUV light. From engineering‑implementation perspective, DPP has fewer subsystems; theoretically R&D cycle might be shorter, manufacturing cost possibly lower. This is a non‑negligible advantage given current technological blockade and resource constraints."
Professor Chen's words drew nods from many present—especially several experts leaning toward engineering implementation and cost control. Under immense external pressure, choosing a seemingly "shortcut" route held natural appeal.
Yet scarcely after DPP supporters finished, a young talent specializing in plasma physics, Dr. Wang, immediately stood up—his tone bore researchers' stubbornness and urgency. "Professor Chen, you only mentioned DPP's strengths, deliberately avoiding its fatal weaknesses! **Debris problem!** And **power bottleneck**!"
He walked quickly to the screen, almost pointing at DPP's schematic. "Discharge‑produced‑plasma process extremely violent—generates huge amounts of high‑speed ions, atom clusters, electrode‑material particles—these are lethal 'debris.' Debris sprays out at high velocity, contaminating and damaging **multilayer‑mirrors** collecting EUV light—mirrors incredibly expensive! Once mirror surface contaminated, reflectivity plummets; entire light‑source system soon fails. Though many studies attempted mitigating debris via magnetic‑field confinement, buffer gas, etc.—so far no solution fundamentally solves it, especially pursuing high‑power output, debris generation becomes worse!"
He switched to a comparison chart clearly showing LPP and DPP simulated contamination on collector‑mirror surface after prolonged operation. DPP‑corresponding mirror nearly covered with "spots," LPP's relatively cleaner.
"As for power," Dr. Wang pushed his glasses, gaze sharp behind lenses, "DPP route, due to its physical‑mechanism limitation, finds power‑increase extremely difficult. Current laboratory‑level DPP light‑sources—power far below **250‑watt** average power required for EUV lithography machine commercialization—huge gap, not even one‑tenth stably achievable! Whereas LPP route—" he pointed to LPP's architecture diagram, "—though system complex, requiring powerful laser striking tiny tin‑droplet targets—its produced plasma 'cleaner,' debris relatively controllable; more importantly, **it possesses clear physical prospect in power scalability**! ASML already proved this! To catch up, even surpass in future—must choose route with higher ceiling!"
Dr. Wang's speech won support from many young researchers in team—eyes shining with challenge‑limit, pursue‑peak light.
The meeting descended into heated debate. Both sides clung to their views, citing classics, data‑charts flying. DPP supporters emphasized real‑world constraints and rapid‑breakthrough possibility—calling it "pragmatic choice." LPP supporters focused on technological ceiling and long‑term competitiveness—calling it "right choice."
"Pragmatic" vs. "right"—these words like two mountains pressed upon Xiuxiu's shoulders. As technical lead, final decision rested on her. This choice wasn't merely selecting a technical parameter; it concerned Chinese EUV lithography undertaking's development direction for next decade, the ultimate return on countless researchers' hard work, whether truly breaking overseas giants' absolute monopoly in highest‑end chip manufacturing.
She listened quietly to both sides' debate; mind racing. Professor Chen's mentioned "simpler structure," "possibly lower cost" not without reason—indeed tempting option during initial breakthrough phase. But Dr. Wang's pointed‑out "debris problem" and "power bottleneck"—were physical chasms DPP route hard to surmount. She knew in cutting‑edge technology, some physical limits impossible bypass via engineering tricks. Choosing a route with obvious ceiling—might see some results short‑term, but long‑term—equivalently binding hands and feet, forever following others picking up scraps.
Her thoughts drifted toward Mozi's building "antifragile" model—system aiming to benefit from volatility and shocks. Choosing LPP route undoubtedly meant facing extremely complex system‑integration challenges—conquering ultra‑high‑power lasers, precise tin‑droplet targets, efficient debris‑mitigation, ultra‑stable control—a series of world‑class difficulties; process inevitably filled with volatility, stress, failure. But wasn't this another form of "antifragile" tempering? By overcoming these hardest bones, team's capability, technology's depth, system's resilience would leap qualitatively. Choosing relatively "easier" DPP route—seemingly avoiding short‑term risks—actually might keep team and entire technological system in comfort zone, becoming "fragile"—once encountering higher‑level competition or own bottlenecks, powerless to respond.
She recalled Yue'er's discussion about "rigidity" and "flexibility." LPP route, precisely because complex system, many subsystems—could through exquisite control and design exhibit better "robustness" (rigidity) and "adaptability" (flexibility) under different operating conditions. Whereas DPP route, its inherent physical defects (e.g., debris) might make system essentially possess hard‑to‑eliminate "fragile points."
Debate gradually quieted; everyone's gaze turned toward Xiuxiu, who remained silent. Only low hum of air‑conditioning system remained in meeting room. Several senior academicians also watched her—gaze containing concern, expectation, also scrutiny.
Xiuxiu slowly looked up, gaze sweeping each face present—some anxious, some eager, some contemplative. She took a deep breath; voice clear and steady, yet carrying undeniable force, echoing in quiet room.
"Thank all professors for candid exchange and deep analysis. Strengths‑weaknesses of both routes already very clear." She paused, seeming to final‑confirm her inner answer. "I decide—our EUV light‑source R&D will unwaveringly follow **LPP route**."
Immediately, slight stir arose in room. Experts supporting DPP showed hard‑to‑conceal disappointment; young supporters of LPP revealed uplifted expression.
Xiuxiu raised hand, signaling quiet, continued: "I understand Professor Chen and colleagues' hopes for DPP route's rapid breakthrough, also deeply realize its relatively simpler structure may bring initial advantage. But we must clearly recognize: **DPP route's 'simplicity' comes at cost of sacrificing performance ceiling and long‑term reliability.** Debris problem and power bottleneck—are 'original sin' rooted in its physical mechanism—hard to cure. We invest huge funds and manpower—goal not manufacturing a 'usable' EUV lithography machine—but creating one capable of participating global top‑tier competition, even achieving leadership in future!"
Her voice gradually rose, carrying a technology‑leader's unique resoluteness based on deep insight. "LPP route—system indeed complex, challenges huge. But that's precisely its value! Conquering these challenges means we'll master series of core capabilities—from high‑end laser technology, precision target technology, plasma control to ultra‑clean optical processing. This process will greatly temper our team, solidify our technological foundation. Like climbing Mount Everest—choosing south‑slope (LPP) though steeper, more dangerous—but it's mainstream route, possesses more complete support, clearer summit path. Whereas north‑slope (DPP)—seems easier in certain segments—but ultimately may encounter insurmountable ice‑wall (physical limits)."
She walked to screen, pointed at LPP's complex system diagram; eyes blazing. "This system—each subsystem is a technological hill requiring conquest. Drive laser—we'll do it! Tin‑droplet generator—we'll do it! Debris‑mitigation system—we'll do it! High‑power collector‑mirror thermal management—we'll also do it! I know it's hard, extremely hard. But please think—why did we return, gather here? Precisely to conquer these hardest technological fortresses—letting China possess our own, resounding voice on semiconductor industry's highest stage!"
Her words struck everyone's hearts like heavy hammer. Those originally hesitant and worried—gaze gradually turned firm. Xiuxiu didn't avoid difficulties; laid them bare, transformed into must‑conquer targets.
"Choosing LPP means we choose hardest road, but also choose highest ceiling, broadest future." Xiuxiu's gaze swept room again; tone became weighty, filled with trust. "I know everyone here harbors same dreams and patriotic will. Road ahead inevitably thorn‑filled—we'll encounter countless failures, bear unimaginable pressure. But I believe—as long as we share goals, unite efforts—no difficulty unconquerable! This harder road—I, Xiuxiu, will walk forefront. I need you—walk with me—make this road passable, keep walking!"
No impassioned slogans—only calm analysis, firm choice, weighty trust. This moment—Xiuxiu radiated not merely top scientist's wisdom, but a technology‑commander's resoluteness and courage at critical juncture.
The meeting room fell briefly silent; then, someone started clapping—gradually sparse to dense, finally converging into warm, sustained wave of applause. Whether earlier supporting which route—all unified thinking, consolidated consensus through Xiuxiu's resounding exposition.
Professor Chen also slowly applauded; watching Xiuxiu—initial disappointment transformed into understanding, approval. He nodded, murmured softly: "Later‑generation formidable indeed… Perhaps—this truly resolute choice."
Xiuxiu looked at newly cohesive team; a weighty stone in heart partly lifted. She knew this only first step of long march—real difficulties and dangers still ahead. But direction now clear, team assembled. She would lead this team—resolutely embarking on climbing LPP—this steep peak.
She returned to seat; on notebook, firmly wrote "LPP route—final decision"—beside it drew a small, yet utterly determined arrow, pointing straight forward. That was light's direction—also direction she and her team must conquer with wisdom and sweat.